Sachem Patch Business Notebook, October 18

Businesses in the Sachem community have reported nothing but positive developments this past week. Here’s a look at what’s happened lately:

Sigma Corporation of America Introduces Updated Lens: Sigma Corporation of America, located in Ronkonkoma, has annouced the recent availability of the its 18-200mm F3.5-6.3 II DC OS HSM lens, according to Business Wire. The lens is an update of Sigma's 18-200mm F3.5-6.3 DC OS HSM, with improved lens performance due to the company's new "F" Low Dispersion (FLD) glass elements. It also includes Sigma's Hyper Sonic Motor (HSM), Super Multi-Layer Coating, and Sigma's Optical Stabilization (OS) system. The updated lens is available in Canon and Nikon mounts for the MSRP of $720, and will be on display at the PhotoPlus Expo in New York City later this year.

Symbol Technologies Awarded Two U.S. Patents: Symbol Technlogies of Holtsville, a subsidiary of Motorola Solutions and supplier of mobile data capture and delivery equipment, was recently awarded two patents for technologies developed by California inventors. The first patent, developed by Ajay Malik of San Jose, was applied for on April 28, 2006. The technology is described as "methods and apparatus for a consolidated switch for use with networked RF components," according to MSP News. Also according to MSP News, the second patent was developed by Ramakrishnan Nagarajan of Sunnyvale and involves a "wireless switch with virtual wireless switch modules."

Federal Contract Granted to Grace Electronics: Grace Electronics LLC, an engineering and manufacturing company located in Holbrook, was recently awarded a federal contract from the Defense Logistics Agency's Defense Supply Center in Richmond, Virginia. The contract was in the amount of $284,925 and was granted for switch assemblies.

Codima Inc. Acquires and Installs Copper Wire Granulator: Through its subsidiary TRC Inc., the network management tool provider Codima, Inc. has announced its acquisition and installation of a cable wire granulator at its Holbrook facility, according to Globe Newswire. This new equipment successfully separates the insulation and copper within wire through a grinding and granulating process, formulating clean copper nodules that Codima will then sell. The machine is a 220 volt and is able to produce 475 pounds of wire every hour, tentatively producing $1 million gross profit per year.

VAI a Sponsor for Biscotti Toback Food & Beverage Forum: ERP software provider Vormittag Associates, Inc. (VAI) has announced its sponsorship at the 9th Annual Biscotti Toback Food & Beverage Forum, according to Marketwire. The event, to be held on October 19 at the de Seversky Culinary Arts Center in Westbury, will involve networking opportunities with industry experts, presentation of notable industry products and a CEO Best Practice Panel and discussion. VAI will showcase its S2K Enterprise for Food Software at the forum, an integrated ERP solution that enables businesses to manage enterprise resources, supply chain and customer relationships more efficiently and effectively through integrating and automating various processes.

Have business news for this notebook or a story idea? Email Sachem Patch editor Chris Vaccaro at Chris@Patch.com or Patch contributor Erin Rafferty at Erin.R.Rafferty@gmail.com.